Relife Instrument BGA TX3 reviews
Product details
Product description
The bga relife tx3 is an instrument designed for separating and extracting integrated components from motherboards, intended for gsm service technicians and microelectronics laboratories. The manufacturer describes it as a precision tool for delicate procedures. It is used for work on bga chips that are soldered onto the board.
features. The relife tx3 instrument is designed for precise control during component separation operations. The thin tip allows it to penetrate under the edge of the chip after it has been heated. Its shape is suitable for working under a microscope. It is intended for use in gsm services and microelectronics laboratories. It is not a tool for disassembling the casing or the screen.
its use requires experience in microblading.
use in service. The chip heats up evenly until the solder melts and the adhesive softens. The instrument is inserted under the edge and gently lifts the component without applying any force. Lifting the material before it is completely melted can cause the pads to detach.
on adhesive pads placed under the chips, the area is cleaned after removal using the same tool. The work is done with an esd armband and on an anti-static mat. The adjacent components are protected with heat-resistant tape.
maintenance and storage. The tip is cleaned of any adhesive or solder residue after each use. Isopropyl alcohol and a lint-free cloth are used. The tip is not used as a lever for large parts. The instrument should be stored with its tip protected, in a holder or box. Contact with other metal tools can deform the tip. A broken fork is replaced.
Additional info
- EU Responsible details are here.
- A maximum of 5 units of this product can be ordered. Trendyol reserves the right to cancel orders over 5 units.
- Sold and fulfilled by .
- Barcode No: 6941590217178
