SUNSHINE Instrument BGA SS-101F reviews
Product details
Product description
The bga sunshine ss-101f is an instrument for precisely removing adhesive and cleaning bga chips during repairs on circuit boards. The manufacturer describes it as a tool for delicate repairs. The package contains an ergonomic double handle with dimensions of 135 x 9 x 9 mm.
features. According to the supplier’s information, the sunshine ss-101f instrument has a double handle and measures 135 x 9 x 9 mm.
the thin shape allows for work in the crowded areas of the board. The handle is designed for young people to use during precision operations. The main purpose is to remove the adhesive from under and around the bga chips.
the underfill adhesive prevents the chip from being disassembled and cleaned. The tool helps to remove it without damaging the surrounding rails.
use in service. The adhesive usually softens with heat before being removed mechanically. The instrument is used with short, controlled movements, under a microscope. Excessive pressure can cause the pads to detach from the board. After removing the adhesive, the area is cleaned with flux and flux remover to prepare it for reballing. The tool is also used on the disassembled chip to clean the edges.
the work is done with esd protection on the workbench.
maintenance and storage. After use, the tips are cleaned of any adhesive residue and flux. Isopropyl alcohol and a lint-free cloth are used.
valves are not used as levers for large components. The instrument is stored in a box or on a stand, with its tips protected. Contact with other metal tools can cause the edges to chip. A deformed screw is replaced to prevent scratching the plate.
Additional info
- EU Responsible details are here.
- A maximum of 5 units of this product can be ordered. Trendyol reserves the right to cancel orders over 5 units.
- Sold and fulfilled by .
- Barcode No: 6941590206417
